Shinryo's
Wafer Bump Plating Service
Shinryo's
An Expert of Micro Bump Plating on 200mm＆300mm wafers
Shinryo's Electroplating Dept., belonging to Mitsubishi Chemical Group and located in Kitakyushu, Japan, offers bump plating service on wafers and substrates.
With our advanced micro plating capabilities that enable the formation of φ10μm or finer wafer bumps, and our diverse melting point range of solder lineups, we offer plating service that is one of the most cutting-edge, flexible and customer-oriented of world's OSAT and EMS companies.
If you are looking for wafer plating service for 200mm and 300mm wafers, we offer you a customizable and to-the-point solution.
We are looking forward to meet new oversea customers.
Characteristics of Shinryo's Solder Plating/Bumping
Fine Pitch Wafer Bumping
Plating Solders of Various Melting Points
Flexibility of Plating Service/Support of Small Lot Trial
Fine Pitch Bump Plating
on Wafers and Substrates
Shinryo is specialized in solder bump forming with minimized bump pitch:
the minimum solder bump pitch is 6μm and the smallest bump diameter is φ3μm.
Our fine pitch bump plating fits to the ongoing trend of miniaturization and high-functionalization of semiconductor packaging, such as HBM, 2.5D/3D, and heteregenious integration.
the minimum solder bump pitch is 6μm and the smallest bump diameter is φ3μm.
Our fine pitch bump plating fits to the ongoing trend of miniaturization and high-functionalization of semiconductor packaging, such as HBM, 2.5D/3D, and heteregenious integration.
・Shinryo performs the processes of sputtering, photo resist coating, exposure and development, plating, resist stripping, seed layer etching, and reflowing.
・Upon your request, we can flexibly exclude some of the processes, or add some extra process like wafer thinning and dicing.
・After processing, we prepare a report with data of the bump heights, diameters, and apperances and suggest methods to have even more yield in the next prototyping.
Plating Solders of Various Melting Points
Shinryo has variety of Pb-free solder for plating, with their melting points ranging from 60℃ to 280℃.
Considering the property, heat resistance, and the use of the devices to apply our plating, we offer you the best suitable solder with our bumping service for each components.
Our newest solder alloy Sn-Bi-In's melting point can be adjusted between 60℃ to 110℃.
Low melting point solders like Sn-Bi-In are developed to reduce damage and warpage on devices and substrates at mounting process.
They are suitable for bonding of low-heat resistant materials
like LEDs, compound semiconductors(Cd-Te and CZT), and resin substrates.
Flexibility of our Plating Service
We accept not only Si wafers, but also other types of wafers such as glass, SiC, InP, GaAs, and panel substrates.
Other than wafers and substrates, we also undertake plating on small components like solder balls, metal powders, and wires.
Shinryo is happy to help our customers from the trial stage,
so we gladly accept even 1 wafer or 1 lot of the components for a trial.
When you do not have wafers for TEG production, we can prepare them ourselves. Please feel free to ask.
Other than wafers and substrates, we also undertake plating on small components like solder balls, metal powders, and wires.
Shinryo is happy to help our customers from the trial stage,
so we gladly accept even 1 wafer or 1 lot of the components for a trial.
When you do not have wafers for TEG production, we can prepare them ourselves. Please feel free to ask.
Application Example : Low-Melting Point Solder Bump Plating
for Cd-Te/CdZnTe Sensor
Combining our fine pitch bumping technology and low-melting point solder,
we realize best bonding solution for high-end sensor products in medical use.
Issues of Bonding Compound Semiconductors
① On Reflowing Condition：
・Properties of semiconductor change under high temp.
・Compound semiconductors may get damaged due to the thermal expansion coefficient difference between the substrates or chips.
② On Micro Miniaturization:
・Higher integration is required for minimizing the device and getting clearer CT image.
① On Reflowing Condition：
・Properties of semiconductor change under high temp.
・Compound semiconductors may get damaged due to the thermal expansion coefficient difference between the substrates or chips.
② On Micro Miniaturization:
・Higher integration is required for minimizing the device and getting clearer CT image.
↪Shinryo's Solution with Low-melting Point Solder and Micro Bumping
For further information andrequest of plating trial, feel free to contact us.
We are happy to hold a Teams meeting and answer you questions.
We are happy to hold a Teams meeting and answer you questions.
Shinryo Corporation
Head Office：RISO Kurosaki-ekimae Bldg, 3-9-22, Kurosaki,Yahatanishi-ku, Kitakyushu-shi,Fukuoka 806-0021
Electroplating Dept.：5-1-13, Minami-Futajima, Wakamatsu-ku,Kitakyushu-City
TEL: ＋81-(93)-701-3558
Head Office：RISO Kurosaki-ekimae Bldg, 3-9-22, Kurosaki,Yahatanishi-ku, Kitakyushu-shi,Fukuoka 806-0021
Electroplating Dept.：5-1-13, Minami-Futajima, Wakamatsu-ku,Kitakyushu-City
TEL: ＋81-(93)-701-3558
Copyright © Shinryo Corporation.