Shinryo's electroplating helps your idea come true.
Shinryo's Electroplating Dept. is a business entity which undertakes contract plating on wafers, substrates, and other small electric components provided by customers.
With our plating solder of various melting points(60℃~280℃), fine pitch solder bumping of minimum φ3μm on wafers and other shapes of substrates, and evenly metal layer forming by plating on wires, solder balls, and metal powders, Shinryo excels at backing up your company's trial and mass production of semiconductor and other types of electronic devices.
Characteristics of Shinryo's Solder Plating/Bumping
Fine Pitch Bumping
Plating Solders of
Various Melting Points
Flexibility of Plating Service
/Support of Small Lot Trial
Fine Pitch Bumping on Wafers
Shinryo is specialized in solder plating with minimized bump pitch: the minimum solder bump pitch is 6μm and the smallest bump diameter is 3μm.
Our fine pitch bump plating fits to the ongoing trend of miniaturization and high-functionalization of semiconductor devices.
・On bumping of wafers and substrates, Shinryo performs the processes of sputtering, photo resist coating, exposure and development, plating, resist stripping, seed layer etching, and reflowing. ・Upon your request, we can exclude some of the processes, or add some extra process like wafer thinning and dicing.
Plating Solders of Various Melting Points
Shinryo has variety of Pb-free solder for plating, with their melting points ranging from 60℃ to 280℃.
Considering the property, heat resistance, and the use of the devices to apply our plating, we offer you the best suitable solder for each components.
We call our solder with melting points lower than 156℃ Shinryo's low melting point solder. The newest solder Sn-Bi-In's melting point can be adjusted between 60℃ to 110℃. Shinryo's low melting point solders are developed to reduce damage on devices at mounting process. They are especially best for jointing of low-heat resistant materials like LEDs, compound semiconductors, and flexible resin substrates.
Flexibility of our Plating Service
We accept not only Si wafers, but also other types of wafers and substrates like Glass, SiC, InP, GaAs and so on. Other than wafers and substrates, we perform plating on small components like solder balls, metal powders, and wires.
Shinryo is happy to help our customers from the trial stage, so we gladly accept even if you have only 1 wafer or 1 lot of the components for a trial.
For further information and request of plating trial, feel free to contact us.