Shinryo's
Wafer Bump Plating Service
Shinryo's
An Expert of High Density Bumping on 200mm＆300mm Wafers
Shinryo's Electroplating Dept., belonging to Mitsubishi Chemical Group and located in Kitakyushu, Japan, offers bump plating service on wafers and panel substrates.
With our advanced micro plating capabilities that enable the formation of φ10μm or finer wafer bumps, and our diverse melting point range of solder lineups, we offer plating service that is one of the most cutting-edge, flexible and customer-oriented of world's OSAT and EMS companies.
In fiscal 2026, Shinryo plans to expand φ300mm wafer plating production capacity in winter, and install automated bump appearance inspcetion apparatus, to respond to increasing prototype/mass-production demands from a broader range of customers, while ensuring a robust and reliable quality assurance framework.
If you are looking for wafer plating service for φ200mm, 300mm wafers and panel shaped substrates, we offer you a customizable and to-the-point solution.
We are looking forward to meet new oversea customers.
Characteristics of Shinryo's Solder Plating/Bumping
High Density Wafer Bumping
Solder Bumps of Various Melting Points
Flexibility of Plating Service/Support of Small Lot Trial
High Density Bump Forming
on Wafers and Substrates
Shinryo is specialized in solder bump forming with minimized bump pitch:
the minimum solder bump pitch is 6μm and the smallest bump diameter is φ3μm.
Our fine pitch bump plating fits to the ongoing trend of miniaturization and high density interconnect packaging, such as HBM, 2.5D/3D, and heteregenious integration.
the minimum solder bump pitch is 6μm and the smallest bump diameter is φ3μm.
Our fine pitch bump plating fits to the ongoing trend of miniaturization and high density interconnect packaging, such as HBM, 2.5D/3D, and heteregenious integration.
・Shinryo provides complete wafer bump plating services, including sputtering, photoresist coating, exposure and development, plating, resist stripping, seed layer etching, and reflow for fine pitch micro bump applications.
・Upon request, we can flexibly customize the process flow, excluding selected steps or adding services such as wafer thinning and dicing to meet specific customer requirements.
・After processing, we provide a detailed report covering bump height, diameter, and appearance data, along with recommendations to improve yield and optimize future prototype and mass-production runs.
・Upon request, we can flexibly customize the process flow, excluding selected steps or adding services such as wafer thinning and dicing to meet specific customer requirements.
・After processing, we provide a detailed report covering bump height, diameter, and appearance data, along with recommendations to improve yield and optimize future prototype and mass-production runs.
Solder Bumps of Various Melting Points
Shinryo offers a wide range of Pb-free solder plating materials for wafer bump plating and micro bump plating, with melting points ranging from 60°C to 280°C.
Based on device characteristics, heat resistance requirements, and packaging applications such as advanced packaging, 2.5D/3D integration, and HBM devices, we recommend the most suitable solder alloy and bumping solution for each component.
Based on device characteristics, heat resistance requirements, and packaging applications such as advanced packaging, 2.5D/3D integration, and HBM devices, we recommend the most suitable solder alloy and bumping solution for each component.
Our newest solder alloy Sn-Bi-In's melting point can be adjusted between 60℃ to 110℃.
Low melting point solders like Sn-Bi-In are developed to reduce damage and warpage on devices and substrates at mounting process.
They are suitable for bonding of low-heat resistant materials
like LEDs, compound semiconductors(Cd-Te and CZT), and resin substrates.
Flexibility of our Plating Service
We accept not only Si wafers, but also other types of wafers such as glass, SiC for power devices, InP and GaAs for photonics and communication devices, and panel substrates for chiplet and heterogeneous integration packaging.
Other than wafers and substrates, we also undertake plating on small components like Cu core balls, metal powders, and wires.
Shinryo is happy to help our customers from the trial stage, so we gladly accept even 1 wafer or 1 lot of the components for a trial. When you do not have wafers for TEG production, we can prepare them ourselves. Please feel free to ask.
Other than wafers and substrates, we also undertake plating on small components like Cu core balls, metal powders, and wires.
Shinryo is happy to help our customers from the trial stage, so we gladly accept even 1 wafer or 1 lot of the components for a trial. When you do not have wafers for TEG production, we can prepare them ourselves. Please feel free to ask.
Application Example : Low-Melting Point Solder Bump Plating
for Cd-Te/CdZnTe Sensor
Combining our fine pitch bumping technology and low-melting point solder,
we realize best bonding solution for high-end sensor products in medical use.
Issues of Bonding Compound Semiconductors
① On Reflowing Condition：
・Properties of semiconductor change under high temp.
・Compound semiconductors may get damaged due to the thermal expansion coefficient difference between the substrates or chips.
② On Micro Miniaturization:
・Higher integration is required for minimizing the device and getting clearer CT image.
① On Reflowing Condition：
・Properties of semiconductor change under high temp.
・Compound semiconductors may get damaged due to the thermal expansion coefficient difference between the substrates or chips.
② On Micro Miniaturization:
・Higher integration is required for minimizing the device and getting clearer CT image.
↪Shinryo's Solution with Low-melting Point Solder and Micro Bumping
For further information andrequest of plating trial, feel free to contact us.
We are happy to hold a Teams meeting and answer you questions.
We are happy to hold a Teams meeting and answer you questions.
Shinryo Corporation
Head Office：RISO Kurosaki-ekimae Bldg, 3-9-22, Kurosaki,Yahatanishi-ku, Kitakyushu-shi,Fukuoka 806-0021
Electroplating Dept.：5-1-13, Minami-Futajima, Wakamatsu-ku,Kitakyushu-City
TEL: ＋81-(93)-701-3558
Head Office：RISO Kurosaki-ekimae Bldg, 3-9-22, Kurosaki,Yahatanishi-ku, Kitakyushu-shi,Fukuoka 806-0021
Electroplating Dept.：5-1-13, Minami-Futajima, Wakamatsu-ku,Kitakyushu-City
TEL: ＋81-(93)-701-3558
Copyright © Shinryo Corporation.